Project Name: Thermal Expansion Coefficient Tester Board

Project Content: Chip Decryption, PCB Cloning, BOM Production

Customer: Xi'an

Project Features: LPC2119 Chip Decryption

The customer approached us with the need for a thermal expansion coefficient tester board used for testing various materials' thermal expansion coefficient, linear expansion, softening point temperature, and phase transition curves under high temperatures. This product is commonly used in research institutes, and the customer's demand is relatively small. They require the boards for maintenance and repair purposes.

The project involves a straightforward process for us, starting with chip decryption, followed by testing and then copying the board and creating the BOM list. Since the customer will handle the maintenance and debugging, the project flow aligns well with their requirements.

The main chip in the project is the LPC2119 chip, which has been successfully decrypted, allowing us to offer it at a significantly lower price compared to the market. After receiving and testing the chip, the customer confirmed its performance, and we proceeded with the PCB cloning and BOM production. The board design is not complex, a single-sided design, with custom inductances provided by the customer's familiar suppliers.

Here are some parameters of the customer's product for testing:

1. Temperature Range Options: -260°C to 600°C, room temperature to 1000°C to 1400°C, room temperature to 1600°C, and room temperature to 2000°C (multiple specifications available).
2. Heating Rate: Adjustable from 0.1 to 20K/min. Heating Power: 3 kW. Heating Method: Resistance Furnace / Infrared Heaters.
3. Displacement Deformation Sensitivity: 1um/digit or 0.1um/digit, with high accuracy inductive displacement (size available).
4. Sample Size: Length up to 50mm or long up to 20mm, diameter: 6mm to 8mm.
5. Test Atmosphere: Vacuum (10-1 mbar), static and dynamic; inert or reactive gas.
6. Sample States: Solid, powder (additional mold required).
7. Sample Holder: Quartz, alumina, graphite, etc. (as per requirements).
8. Operating Environment: Windows (XP) operating system.
9. Display: Digital display with a dedicated interface to the host computer for data processing.
10. Provides various test environments for analyzing structural changes of comparative materials under different conditions.
11. Instrument System Accuracy: 0.25% repeatability error ≤ ± (0.1-0.2) * 10e-6.

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