As a leading force in the field of PCB reverse engineering in Shenzhen, Dongdao Technology combines the latest EDA design software, professional PCB cloning technicians, and advanced manufacturing processes. We have the capability to clone single-layer, double-layer, and multi-layer (up to 32 layers) PCB circuit boards, and are adept at tackling challenging tasks, such as the reverse engineering of PCBs with blind buried vias.

Currently, the company has successfully completed technical research on the PCB cloning of infrared thermal imagers and IC decryption. Below is a brief introduction to the infrared thermal imager:

Infrared Thermal Imager Description:

The target size is usually over 10 meters, and the detection distance can reach several tens of meters. However, the size of the damaged parts that need to be inspected is only a few tens of centimeters. For example, the diameter of a steel plant's hot blast stove is 10 meters, with a height of 30-50 meters, but each refractory brick is only 20 centimeters wide. Customers need to be able to view both the overall thermal image of the target and the detachment issues of the refractory bricks.

Infrared Thermal Imager Equipment Requirements:

1. Over 3 million pixels, sufficient field of view angles, and excellent spatial resolution, enabling overall and long-range comprehensive analysis of large areas/regions, as well as detecting many difficult-to-find details or small issues, improving detection comprehensiveness and efficiency while avoiding omissions or risks of accidents.

2. The most advanced focusing methods for time-saving focusing, such as LaserSharp® laser autofocus, automatic focus, manual focus, and EverSharp multi-focus point recording function, integrating multiple focusing methods. This ensures accurate focus and captures all accurate data under almost any circumstances.

3. Infrared thermal imaging, video recording with infrared data, and WiFi transmission to ensure it serves as a powerful basis for in-depth research.

Infrared Thermal Imager Applications:

• Maintenance of large industrial equipment, such as the reaction tower and distillation tower in petrochemical companies, and blast furnaces in metallurgical companies.
• Tunnel/dam/bridge water leakage detection.
• Geological research/exploration and volcano research.
• Building maintenance, such as airports and buildings.

Temperature Measurement:

• Temperature Measurement Range: -40°C to +1200°C, high-temperature option: up to 2000°C; -40°C to +1200°C.
• Accuracy: ±1.5 degrees or ±1.5%, whichever is greater.
• Emissivity Correction: Yes.
• Background Temperature Correction: Yes.
• Correction Functions: Based on laser rangefinder distance correction, emissivity (manual or material table), transmissivity, ambient temperature, humidity (optional).

Color Palettes:

• Standard Color Palettes: Rainbow, grayscale, iron red, blue red, mark, high contrast, steps, black red, molten metal, mint green, brown black, grayscale/rainbow.

General Parameters:

• Color Alarms: High-temperature and low-temperature alarms.
• Spectral Range: 7.5 μm to 14 μm (long wave).
• Operating Temperature: -25°C to +55°C.
• Storage Temperature: -40°C to +70°C.
• Humidity: 10% to 95% relative humidity, non-condensing.
• Center Point Temperature Measurement: Yes.
• Measurement Functions (selectable): Multiple measurement points and regions of interest (ROIs), high-temperature/low-temperature spot detection, isotherms, profiles, temperature differences.
• Center Frame: Yes, adjustable shape (region of interest) for further analysis (minimum, maximum, average).
• Impact Resistance: 25G, IEC 68-2-29.
• Vibration Resistance: 2G, IEC 68-2-6.
• Dimensions (L x W x H): 210mm x 125mm x 155mm (8.25 in x 4.9 in x 6.1 in), 206mm x 125mm x 139mm (8.1 in x 4.9 in x 5.5 in).
• Weight: 1.95 kg (4.3 lb), 1.4 kg (3.2 lb).
• Viewfinder: Variable angle LCoS color viewfinder, 800 x 600 pixel resolution.
• Ergonomics: Equipped with a handle for easy camera operation.

As a long-term, high-tech enterprise specializing in reverse technology research, Dongdao PCB Cloning Company in Shenzhen provides professional services such as multi-layer PCB cloning, photomask output, BOM (Bill of Materials) production, and schematic reverse engineering. Together with our chip decryption, IC decryption, PCB production, PCB modification, and prototype production capabilities, we can offer worry-free one-stop services to assist customers in product reference design and technical research applications.