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Investigate the PCB copy board how to handle encounters blind and buried vias
Update date:2012-6-25
A.What is blind and buried vias
Blind and buried vias PCB, also known as HDI boards, often used for mobile phones, GPS navigation, etc. The application of high-end products. Conventional multi-layer circuit board structure, with the inner lines and outer lines, re-use drill hole, and hole metallization process to make the link function between the internal layers line. With the development of electronic products to high-density, high-precision, corresponding to the circuit board the same request. Pcb density is the most effective way to improve is to reduce the number of vias, and accurate set up a blind hole, buried to fulfill the requirement, which should be transported to produce HDI board. HDI boards, such as the common apple mobile phone is used, there is also a slim phone with this board.
Buried hole called BURIED HOLE (the outer layer would not be visible), the through-hole, is the inner, upper and lower sides are within the board, layer after lamination can not see so do not occupy the outer area of ​​the blind Kong is also known as bLIND hOLE., and through-hole relative terms, the through-hole refers to the layers are drilled through holes, blind holes, non-drilled through-hole; Simply put, it is the blind hole surface can be seen side but the other side is board house, we also look at less than the popular saying is that we usually grown vegetables, stems and leaves to spend up to break through the soil, but roots in the soil inside, we have not see the above hole .
Blind and buried vias copy board
When you meet a blind and buried vias boards, COPY, copy board, companies need to find a professional, such as Shenzhen East conduction technology for blind and buried vias boards have a certain experience, they often help others cloned phone, and some industrial above the high-end board, board layer with 4-12 layers. And charges are reasonable.
Three. Blind and buried vias copy board experience
Blind buried vias of the circuit board to take down the board, a relatively high degree of difficulty, general phone board and board of HDI boards above copy will encounter a blind and buried vias, East conduction technology to copy the blind buried plate when the following experience.
One must be careful to prepare the work before the copy board.
The two devices must be advanced.
Continuously and the original board compared to the copy board, continue to identify problems and constantly revised.
Note that the check to repeatedly check.
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