Printed circuit board (PCB) commonly used terminology 【PCB copy board】
Update date：2012-6-26
Shenzhen East conduction technology for the PCB collected the terminology often encountered in circuit board production process.
(1) printing: some methods, the process of reproduction of the graphics on a surface.
(2) of the printed circuit: on the surface of the substrate, according to a predetermined design using the printing method of the circuit. Including printed circuits, printed components or a combination of a combination of circuit.
(3) wire electrical connections between the printed line: attached to the substrate surface, and components (including shield components) graphics. It does not include printed components.
(4) printed circuit boards or printed circuit boards: the completion of a generic term for printed circuit or printed circuit printed circuit board printed circuit processing. Printed circuit board in accordance with the board of the substrate can be divided into rigid and flexible printed circuit board, points can be divided into a single panel, double sided and multilayer printed circuit board level.
(5) single-panel: only on one side of the pull of the conductive pattern of the printed circuit.
[6) double panel: have a conductive pattern on both sides of the printed circuit board.
(7), multilayer printed circuit board: isolated by three or more conductive pattern layer in which the insulating material layer, laminated combination, between the layers of the conductive pattern required interconnection.
The flexible printed circuit board (8): the use of a flexible substrate made of printed circuit board.
Planar printed circuit board (9): the entire outer surface of the conductive pattern and the substrate surface in the same plane of the printed circuit board.
(10) printed circuit board assembly: electrical, mechanical components or connect the printed circuit board printed circuit board, the printed circuit board technology, welding, coating has been completed.
(11) grid; two sets of equidistant parallel straight line orthogonal grid made. It is used to connect components in printed circuit board positioned its connection point should be located in the intersection of the grid.
Conductive pattern (12): printed circuit board conductive material pattern of structure. It consists of a wire connection plate through holes and printed components.
(13) non-conductive pattern: printed circuit board, non-conductive material (for example; media, resist, solder, graphics, etc.) posed by patterning.
[14) the layout sketch: mark the printed circuit board all parts of the size range and the grid location of a file. It includes a conductive pattern and the arrangement of the conductive pattern, the component size and type, the location of the hole and it should be assembled components must describe the material.
(15) artwork master: the proportion of accurate graphics used to produce photographic original and photoplate structure.
(16) machining diagram: that the figure of the printed circuit board machining size and requirements.
(17) Electrical Installation Figure: show that the graph of words and symbols printed circuit board components to the installation location.
(18) Solder Mask Figure: heat-resistant coating material used to protect or shelter the graphical portion of the selected few solder affect patterns of structure.
(19) marker symbol map: show that the graph of words and symbols printed circuit board components, the installation location.
(20) of the original camera: used to produce a ratio of 111 production photoplate exact original photo bottom plate.
(21) photographic Diban; cloth did the sketch provided for within the accuracy range, the move to production ratio of 1:1 printed circuit board is indeed graphic bottom plate.
(22) through holes: hole wall dust metal holes. Mainly used for electrical connection of the layer between the conductive pattern.
(23) part of the Land: the conductive pattern. Used to connect and welding components. When used for welding components, also known as the pad.
(24) relay Kong: for a wire transfer through the through holes, as the saying said adapter holes or vias.
(25) drill-oriented point: visual drilling order to drill accurately drill into settings to connect to the disk center empty eyes.
Conformal coating layer (26): coated printed circuit board assembly on a non-conductive protective material layer. This coating without damaging the installed device structure, but also known as printed circuit pull assembly coating.
(27) hot-melt: by heating the printed circuit board surface of the tin-lead alloy coating melt crystallization, to improve the weldability of the printed circuit board, and improve the protection of the copper layer of tin-lead co-Jin Duiji body.
(28) HASL: metal hole printed circuit boards and printed wire coated crown eutectic solder a process. Touch solder in printed circuit board dipping melt immediately by two air knives, air knife, the hot compressed air to the printed solder wire and metal hole excess blow to get a smooth, uniform and bright solder coating.
(29) via resistance: the resistance of the metal coating of the pore walls.
(30) interconnect resistance: also known as the hole-wire resistance, which is the total resistance of the wire in series through holes. It consists of a wire connection plate, plated hole wall of resistance and connection plate and the hole wall contact resistance of the connection point.
(31) Weldability: gold surface wetting solder ability.
(32) wetting: a performance of the metal surface, that is, when the molten solder coated pedal to the metal surface after a fairly uniform, smooth, not broken solder thin layer.
(33) sub-humid Tao: a performance of the metal surface, when the surface of the molten solder coated gold Qu after the solder back Shao separated, forming an irregular lump of solder, but it left a thin layer of solder without exposing matrix gold session.
(34) moist: When the molten solder coating to the surface of the gold Qu, the solder is not attached to the metal on the surface, this phenomenon known as the non-welding.
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