PCB design PCB thermal issues [PCB design]
Update date：2012-7-14
The design staff all know, must take into account when routing the PCB thermal problem, for beginners or people joined the line, the East guide technology engineers together and share a little heat in the PCB design process techniques and problems.
Can improve the thermal performance of the PCB design to be considered is the PCB component layout. As long as possible, high-power components on the PCB should be separated from each other. Especially high-power modules, together make local temperature is too high, making the shorter life expectancy, the need for physical separation of the PCB above the high-power devices, this will allow each of the high-power components around the PCB The area is maximized, thus helping to achieve better thermal conduction. Should pay attention to isolate temperature-sensitive components on the PCB with high-power components. Briefly summarize, at design time, we should be in any possible case, high-power components of the installation location should be away from the PCB corner. Especially on the more middle of the PCB location, you can maximize the area of high power components around the board, to help heat.
We consider the cooling time, the second aspect should be considered from the structure of the PCB, this is one of the most decisive influence on the PCB design and thermal performance. To comply with the following general principles: PCB above the copper is more, the higher the thermal performance of the system components. If PCB semiconductor devices, the ideal heat dissipation of the chip is mounted on a large liquid-cooled copper. However, in actual operation, this mounting method is impractical, so we can only other changes to improve the thermal performance of the PCB.
Another way is to increase the thermal conductivity of board size, but difficult to calculate the power consumption and size of the power and general way is to increase the radiator to the high-power devices, such as to LV7805 our common regulator, usually design a cooling in the above.
Four, the fourth aspect is the selection, we know now the general of PCB material is a fiberglass board, in fact, this glass plate is mainly used for general design is no problem, LED light strip above, we used aluminum plate why the aluminum substrate, the main cooling effect is good. In addition to the aluminum plate, as well as iron substrate, ceramic plates, these are heat better. Therefore, the selection is very important.
The above four points are a few suggestions on cooling Shenzhen East guide engineers in PCB design, welcome those who are interested to explore.
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