BOM is produced [PCB cloning]
Update date：2012-7-26
A work of the copy board, BOM list making BOM list is a list of materials for the entire board, which includes all the relevant parameters of the components of the entire board and package forms, BOM is to help us purchase materials only certificate and its relationship to prototype welding commissioning and procurement of the follow-up mass production of components, so the BOM list produced throughout the reverse course of the study is a very important link.
BOM is how to make out of it?
First step, the dissolution of the board.
Demolition board, we will prepare a white paper and a pen, a piece of paper and write down the sequence number and the position number of the components, each component demolished down, corresponding to its position number with double sided tape. class to paste on white paper. This is a preparatory work to do the BOM is worth noting that, in the process of split board components numbered and arranged in need of special care, because the error of the location information of a component may cause the entire BOM list is inaccurate, affecting clone effect. In order to prevent the components is missing, we can also be components of the above with a transparent plastic fixed.
The second step, measurement.
In general, above the chip resistors are screen printing, 0402 The following are screen printing, chip capacitors, chip inductors are not marked parameters, this time will need to be measured, the measurements we need to use measurement tools - - bridge tester. Tester for various components of the impedance analysis, the technical specifications of a measuring instrument, the comparative method to measure the components of resistors, capacitors, inductors. The bridge test equipment have different test results and accuracy.
In general, the bridge tester a reference standard of measurement accuracy, measurement range, measurement speed. High accuracy, wide measurement frequency range, measurement speed tester can not only ensure a higher accuracy rate, but also to improve the measurement of the intensity and efficiency.
Each measurement.
The third step is sorted.
The third step is into computers, what position corresponding components of the entry, do not leak, good. The next step is to sort out, classify the same specifications, the same package, we put the position to put together, easy to use.
The fourth step, check, check the code.
Done the previous three steps, a BOM basic shape, the next step is to check the work to see if there are any omissions, input whether there are errors, some of the transistor and IC whether the model is accurate, are generally in this step to improve.
Through this four-step, to make a the BOM.
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