Ten common problems of the 15th East conduction technology Tan copy board: PCB copy board
Update date：2012-9-21
General novice in the copy board process inevitably met some problems, but as long as the designers pay more attention, you can avoid some of the problems today, I'll tell you enumerate frequently appeared in the PCB copy board process The ten questions for novice reference. A character placed unreasonable characters cover pad SMD lug, brought great inconvenience to the components of the welding and PCB-off test. Sometimes we look at a board, found not find the location silkscreen East a West. The character design is too small, resulting in tough screen printing, and excessive lead characters are stacked on top of each other, become difficult to differentiate. No copy after the original, the size of the screen printing handwriting arbitrary adjustment. . Processing structured community unable to clarify. Single panel design in the TOP layer, if not clarify on the pros and cons of the system board installed on the devices also lack good welding. Such as a four-layer board design using TOP mid1, mid2 bottom four, but the processing time not by such one by one placed, which asked for clarification. Painting pad design line, fill block painting pad after DRC introspection. Filled block, but the process is not directly generate solder mask data as such pads is less than her inability on the solder resist The filled block area will solder resist mask, resulting in a device welding difficult. Sided pad aperture settings. Ordinary single-sided pad does not require drilling, drilling, to be marked out, and its aperture should be designed to zero. If the value is designed, perhaps, in the event of a borehole data, status on the show the coordinates of the hole, the problems will be presented. 2-sided pad if necessary drilling should be extraordinary marked out. V. pads stacked a stack of pads (except paste pads outside), it means that a stack of hole in the drilling step process will be repeatedly in a borehole and cause the drill bit to cut off, initiator the damage of the hole. In multilayer two holes in the stack should be a hole bits for the isolation plate the other holes convergence disk, or plotted film after isolation plate formation scrapped. Graphics layer of abuse do some graphics layer useless connection, that the four-layer board design five floors above the line, will form misinterpreted. Design the easy way, Protel software layers have to draw lines Board layer and use the Board layer to draw dimension lines, such during Photoplotter data, unselected Board layer, the leakage loss connection and disconnection, perhaps due to the selection of the the Board layer of dimension line short-circuit, adhere to when designing graphics layer intact and clear. 3. Contrary to the customary design, the element surface design in the Bottom layer, the welding surface design Top formation of unnecessary trouble. The seven electric stratigraphic connection is spend pad designed power, formation and practice of flower pad method PCB image is opposite, all connections are isolated line that designers should very clear. Should pay attention to draw the line of separation of the group of power or in several places, leaving a gap less than her inability to make two sets of power short circuit, not grams less than the formation of the convergence of regional blockade. Eight. Meter filled blocks too much or filled block filled with a very fine line. The Health Photoplotter data have lost sight Gerber data is incomplete. Filler block light painted data disposal with a line one by one to draw the amount of data that occur as a result of light painted large, add data disposal difficult. 9 area of the grid spacing is too small to constitute a large area of the grid lines is too small (less than 0.3mm) with the line between the edge of the PCB manufacturing process, Figure transfer processes to easily occur much significant shadow after broken membrane attached to the board, the formation of disconnection. X.-shaped frame design does not understand that some customers in Keep layer, Board layer, Top over layer, etc. designed outline and outline do not coincide, resulting pcb copy board manufacturers difficult to judge which outline standards. The above problem is a common problem in the PCB copy board process, summed up for your reference learning.
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