PCB mass production :

Our company boasts a state-of-the-art PCB/FPC production facility, equipped with comprehensive manufacturing lines capable of handling a wide range of hard (PCBs) and flexible (FPCBs) circuit board production. With nearly 20 years of experience, we have established a solid reputation in the industry. Our production capacity includes over 30 layers of multilayer boards, multi-level laser blind-buried boards, and the ability to process high volumes. We can achieve high precision in PCB production, with line widths as small as 3mil (0.075mm) and apertures as small as 4mil (0.10mm). Our monthly production capacity for multilayer boards exceeds 50,000 square meters.

Our dedicated team of engineering and technical personnel coordinates all aspects of PCB production. They have extensive experience in PCB production management, enabling them to efficiently handle various engineering challenges throughout the manufacturing process. With strict adherence to process guidelines, we ensure the acceptance of finished PCB boards meets industry standards. This approach effectively minimizes unnecessary costs and losses for our customers, optimizing their investment and overall satisfaction.

Range of products:
We specialize in processing various materials for circuit boards, including FR4 epoxy glass fiberboard, CEM1, CEM3, BT materials, thick copper boards, high TG boards, heat-dissipating aluminum circuit panels, ultra-compact boards, thick gold boards, mobile phone batteries, key boards, halogen-free boards, Rogers high-frequency boards, and high layer count backplanes. Our technology products encompass a range of surface finishes, such as pure tin spraying, gold plating, immersion gold, immersion silver, immersion tin, OSP (Organic Solderability Preservatives), high TG boards, and aluminum plates.

The processed products we offer have found widespread application across various industries. They are extensively used in computer systems, communication devices, networking equipment, home appliances, instrumentation, medical devices, industrial machinery, automotive systems, semiconductor microelectronics, LCD and LED displays, as well as cell phone camera modules. Our commitment is to deliver high-quality circuit board solutions that meet the diverse needs of our clients in these industries.

Process capability:

PCB production involves two main methods: the hole etching method and the pattern plating method, each with its own advantages and disadvantages. The etching method provides uniform lines and impedance control while posing environmental pollution concerns and the risk of hole breakage resulting in scrapped boards. On the other hand, the pattern plating method offers easier control over alkali corrosion but may result in uneven lines and environmental pollution.

The primary step in line production is the application of dry film, which typically achieves a resolution of 2mil/2mil line width after exposure. Most exposure machines can handle line widths within this range without issues. For line widths of 4mil/4mil or more, the development machine nozzle, pressure, and syrup concentration have less impact. However, for line widths below 3mil/3mil, the nozzle becomes a crucial factor affecting resolution. Fan-shaped nozzles are commonly used, with a pressure of 3BAR for development.

Exposure energy greatly influences line quality, but the general market currently utilizes dry film exposure within the range of 12-18 levels (25-foot exposure) or 7-9 levels (21-foot exposure). Lower exposure energy tends to improve resolution, but if the energy is too low, dust and debris in the air can impact subsequent processes, leading to open circuits during etching or short circuits during alkaline etching. Therefore, the choice of circuit board line width and spacing should consider actual production conditions and darkroom cleanliness.

Exposure machines come in two types: air-cooled with a surface light source and water-cooled with a point light source. Both types typically have a nominal resolution of 4mil, but with adjustments or specific operations, resolutions of 3.0mil/3.0mil or even 0.2mil/0.2mil can be achieved. However, caution must be exercised when reducing energy to 1.5mil/1.5mil due to the potential impact of dust and debris. Additionally, experiments have shown no significant difference in resolution between Mylar and glass surfaces.

Factors such as film speed, temperature during production, board cleanliness, Diazo film cleanliness, etching foil parameters, and exposure cleanliness are crucial in determining the success and quality of the board formation and alkali erosion during the production process.