We are a professional SMT (Surface Mount Technology) factory equipped with a highly experienced production team, functional testing experts, and proficient production managers. Our state-of-the-art SMT processing production line is equipped with advanced equipment, including the latest series of fully automatic multi-chip packaging machines capable of handling chip devices ranging from 0201 to 0402 sizes. We are also capable of mounting QFP, BGA, and ultra-high-precision chips with a thickness of 0.3mm. Our facilities include an imported seven-zone hot air reflow oven, automatic no-clean spray dual wave soldering machines, and automatic solder paste printing presses. These advanced tools ensure precise and high-quality soldering, guaranteeing the reliability of your circuit boards.

With over 10 years of experience, our technical experts and frontline operators in the SMT chip processing plant in Shenzhen have more than five years of work experience. This expertise provides a reliable guarantee for ensuring product quality, adhering to IPC-A-610C CLASS Ⅱ standards, and our own company standards. Our processed products consistently achieve a pass rate of over 99%.

At our company, we uphold a business philosophy that is people-oriented, customer-first, and focused on sustainable experiences. We strictly adhere to ISO9000 quality system management standards, continuously incorporating advanced welding techniques to meet the demands of both domestic and international electronic product replacements. Our commitment is to deliver exceptional quality and meet the evolving needs of the electronic industry.

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